Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Thermal conductivity test for base materials

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Thermal conductivity test for base materials

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£166.00
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1 Scope

This part of IEC 61189 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.