Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA

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£142.00
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1   Scope

This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).