What is PD IEC/TR 61189-3-914 - Thermal conductivity of printed circuit boards about?
PD IEC/TR 61189-3-914 covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies. The main objective of the IEC 61189 series is to demonstrate the reliability of laminate materials and assemblies and avoid printed circuit board failures.
PD IEC/TR 61189-3-914 specifies the detailed procedures and precautions for IEC 61189-3-913.
PD IEC/TR 61189-3-914 was developed as a technical report.
Who is PD IEC/TR 61189-3-914 - Thermal conductivity of printed circuit boards for?
PD IEC/TR 61189-3-914 on thermal conductivity of printed circuit boards for high-brightness LEDs is relevant to:
- Manufacturers of electronic devices
- Manufacturers of printed circuits and boards
- Quality testing agencies
- Electronics industry
- Electronic engineers
Why should you use PD IEC/TR 61189-3-914 - Thermal conductivity of printed circuit boards?
For PCB performance, reliability, and heat management is critical. Delamination, damage, or device failure may result from insufficient heat control.
The temperature, relative humidity, and atmospheric pressure test recommended by PD IEC/TR 61189-3-914 are implemented to ensure or verify the ability to maintain the service life if the specimen is used under standardized conditions, or upon a request to check the atmospheric condition. This helps you to review the test conditions and to pay sufficient attention to high-temperature conditions.
PD IEC/TR 61189-3-914 evaluates the relativity of both heat transfer and thermal conductivity of PCBs consisting of heterogeneous materials.
Overall, PD IEC/TR 61189-3-914 can demonstrate the reliability and performance of a printed circuit board laminate material or a finished product. Events of electrochemical migration and consequent PCB failures can thus be avoided.