Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for…

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for…

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1   Scope

This Technical Report is an intercomparison supporting the development of IEC 61189‑5‑501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.