Test methods for electrical materials, printed board and other interconnection structures and assemblies - Test methods for time to delamination. T260, T288, T300

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Test methods for time to delamination. T260, T288, T300

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£142.00
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1   Scope

This part of IEC 61189 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.