What is BS EN IEC 61760‑2 about?
BS EN IEC 61760‑2 is the second part of the BS EN IEC 61760 multi-series that discusses surface mounting technology. BS EN IEC 61760‑2 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
BS EN IEC 61760‑2 covers climatic conditions are listed below:
- Low air temperature: −40 °C
- Low air pressure: 30 kPa
- Change of air pressure: 6 kPa/min; high relative humidity 75 %
- No dripping waters
- No condensation is allowed
Who is BS EN IEC 61760‑2 for?
BS EN IEC 61760‑2 on transportation and storage condition of surface mounting technology is useful for:
- Transportation service providers
- Inventory managers
- Store managers and store workers
Why should you use IEC 61760‑2?
Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".
The aim of IEC 61760‑2 is during transportation the SMDs, including their chosen style of tapes or stick magazines, etc., shall be protected against extreme temperature, humidity, and mechanical forces. BS EN IEC 61760‑2 helps you regulate the total number of extreme temperature events during transportation and storage.
BS EN IEC 61760‑2 ensures the users of SMDs receive and store products that can be further processed (e.g., positioned, soldered) without prejudice to quality and reliability.