What is BS EN 62137-1-5 – Mechanical shear fatigue test about?
BS EN 62137-1-5 is an international standard that focuses on environmental and endurance tests for surface mounting technology.
BS EN 62137-1-5 is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate. It applies to area array packages, such as BGA.
BS EN 62137-1-5 stipulates the technicalities such as related terms and definitions, test equipment and materials, mounting method, test method and procedure, and judgment conditions, items to be included in the test report, as well as items to be given in the product specification.
Who is BS EN 62137-1-5 - Mechanical shear fatigue test for?
BS EN 62137-1-5 on Mechanical shear fatigue test is useful for:
- PCB manufacturers and suppliers
- Research and Development in electronics
- Quality assurance entities
- Manufacturers and suppliers of electronic devices
- Electrical/ electronic engineers
- Semiconductor foundries
Why should you use BS EN 62137-1-5 - Mechanical shear fatigue test?
The mechanical properties of lead-free solder joints between leads and lands on a printed wiring board are not the same as tin-lead-containing solder joints, due to their solder compositions. Thus, it becomes important to test the mechanical properties of solder joints using different solder alloys.
BS EN 62137-1-5 gives the mechanical shear fatigue test for surface mount solder joints, which is generally used to evaluate the reliability of solder joints. The mechanical shear fatigue test predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints.
BS EN 62137-1-5 is intended to evaluate the strength of the solder joints by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints (e.g., solder alloy, substrate, mounted device, or design, etc.) are evaluated to assist in improving the capacity of the solder joints.