What is BS EN 62137-1-2 – Surface mount solder joint test about?
BS EN 62137-1-2 is a part of an international standard that focuses on aspects of surface mounting technology. It specifies the environmental endurance test methods for the surface mount solder joint.
BS EN 62137-1-2 describes a test method that applies to leadless surface mounting components and surface mounting connectors to which pull test is not applicable.
BS EN 62137-1-2 is also applicable to evaluate the effects of repeated temperature changes on the strength of the solder joints between terminals and lands on a substrate.
Note: BS EN 62137-1-2 is not applicable to multi-lead components and gull-wing leads.
Who is BS EN 62137-1-2 – Surface mount solder joint test for?
BS EN 62137-1-2 on Surface mount solder joint test is useful for:
- Manufacturers of printed circuit boards (PCBs)
- Manufacturers and suppliers of electronic components
- Designers of printed circuit boards (PCBs)
- Quality control and testing personnel
- Regulatory authorities
Why should you use BS EN 62137-1-2 – Surface mount solder joint test?
Shear strength of surface mount solder joint can be defined as the maximum force applied parallel to the substrate and perpendicular to the specimen lateral surface, to break the joint of SMD mounted on a printed board.
BS EN 62137-1-2 lays out the methodology designed to test and evaluate the endurance of the surface mount solder joint between component terminals and lands on a substrate, by means of shear-type mechanical stress.
BS EN 62137-1-2 informs that the mechanical properties of the joint between a terminal to land on a printed wiring board using lead-free solder are not the same for the joint using tin-lead solder due to the difference in composing elements of the solders. Thus, it becomes important to test the mechanical properties of solder joints, using different solder alloys, and after temperature, cycling stresses have been applied.
BS EN 62137-1-2 also covers the test specimens, that are mounted on a substrate by reflow soldering. The durability of the solder joint is evaluated by exposing the electronic components to a rapid change of temperature and applying shear stress to the solder joint.
Adherence to BS EN 62137-1-2, helps users to categorize the adhesives according to the shear strength of the solder joint when pulled from the material.