What is BS EN 62137-1-3 – Cyclic drop test for surface mount solder joint about?
BS EN 62137-1-3 is an international standard that focuses on cyclic drop test and environmental endurance test methods for the surface mount solder joint.
BS EN 62137-1-3 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).
BS EN 62137-1-3 stipulates the technicalities such as related terms and definitions, test equipment and materials, mounting method, test method and procedure, and judgment conditions, items to be included in the test report, as well as items to be given in the product specification.
Who is BS EN 62137-1-3 - Cyclic drop test for surface mount solder joint for?
BS EN 62137-1-3 on cyclic drop test for the surface mount solder joint is useful for:
- PCB manufacturers and suppliers
- Research and Development in electronics
- Quality assurance entities
- Manufacturers and suppliers of electronic devices
- Electrical/ electronic engineers
- Semiconductor foundries
Why should you use BS EN 62137-1-3 - Cyclic drop test for surface mount solder joint?
The mechanical properties of the joint between a terminal to land on a printed wiring board using lead-free solder are not the same for the joint using tin-lead solder due to the difference in composing elements of the solders. Thus, it becomes important to test the mechanical properties of solder joints using different solder alloys.
BS EN 62137-1-3 lays down the technicalities to carry out a cyclic drop test for the surface mount solder joint. This helps users to evaluate the durability of joints that are formed by reflow soldering between SMD pins/electrodes and substrate lands about drop heights.
BS EN 62137-1-3 also helps to evaluate the drop impact that the specimen joint receives, the strain can be used as an indicator of the impact, and it can quantitatively be measured using a strain gauge.
BS EN 62137-1-3 is intended to evaluate the strength of the solder joints of larger-sized multi-terminal components and other components in devices (e.g., handheld mobile devices) if the device is dropped. The properties of the solder joints (e.g., solder alloy, substrate, mounted device, or design, etc.) are evaluated to assist in improving the strength of the solder joints.