1 Scope
In this Part 14 cooling methods below 100 K are described. These low temperature levels
are mainly required by space borne electronic systems operating under very low noise
conditions. Details on the materials used and safety factors are given.
The Thermal design handbook is published in 16 Parts
| TR 17603-31-01 | Thermal design handbook – Part 1: View factors |
| TR 17603-31-02 | Thermal design handbook – Part 2: Holes, Grooves and Cavities |
| TR 17603-31-03 | Thermal design handbook – Part 3: Spacecraft Surface Temperature |
| TR 17603-31-04 | Thermal design handbook – Part 4: Conductive Heat Transfer |
| TR 17603-31-05 | Thermal design handbook – Part 5: Structural Materials: Metallic and Composite |
| TR 17603-31-06 | Thermal design handbook – Part 6: Thermal Control Surfaces |
| TR 17603-31-07 | Thermal design handbook – Part 7: Insulations |
| TR 17603-31-08 | Thermal design handbook – Part 8: Heat Pipes |
| TR 17603-31-09 | Thermal design handbook – Part 9: Radiators |
| TR 17603-31-10 | Thermal design handbook – Part 10: Phase – Change Capacitors |
| TR 17603-31-11 | Thermal design handbook – Part 11: Electrical Heating |
| TR 17603-31-12 | Thermal design handbook – Part 12: Louvers |
| TR 17603-31-13 | Thermal design handbook – Part 13: Fluid Loops |
| TR 17603-31-14 | Thermal design handbook – Part 14: Cryogenic Cooling |
| TR 17603-31-15 | Thermal design handbook – Part 15: Existing Satellites |
| TR 17603-31-16 | Thermal design handbook – Part 16: Thermal Protection System |