Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Classification of defects

Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Classification of defects

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What is BS IEC 63068-1 - Silicon carbide homoepitaxial wafer about? 

BS IEC 63068-1 is the first part of an international standard used for semiconductor devices that helps in classifying the defects in silicon carbide homoepitaxial. By using BS IEC 63068-1 you can manufacture good quality semiconductor devices.  

BS IEC 63068-1 gives a classification of defects in as-grown 4H-SiC (Silicon Carbide) epitaxial layers. The defects are classified on the basis of their crystallographic structures and recognized by non-destructive detection methods including bright-field OM (optical microscopy), PL (photoluminescence), and XRT (X-ray topography) images. 

Who is BS IEC 63068-1 - Silicon carbide homoepitaxial wafer for?  

BS IEC 63068-1 on non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer useful for: 

  • Manufacturer of semiconductor devices  
  • Manufacturers related to electronic devices  
  • Manufacturers of automobile industries  
  • Electronic engineers  

Why should you use- Silicon carbide homoepitaxial wafer 

Silicon carbide homoepitaxial wafer is useful in the fabrication of very high-voltage and high-power devices.  

By using BS IEC 63068-1, you can identify the defects in the silicon carbide homoepitaxial wafer. This helps in classifying the defects according to the crystallographic type and structure. Using BS IEC 63068-1 best practice guidance, you can improve the quality and reliability of silicon carbide homoepitaxial wafers. This results in manufacturing good quality semiconductor devices.