Semiconductor devices. Micro-electromechanical devices - Test methods for MEMS piezoresistive pressure-sensitive device on wafer

Semiconductor devices. Micro-electromechanical devices - Test methods for MEMS piezoresistive pressure-sensitive device on wafer

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What is BS IEC 62047-34- MEMS piezoresistive pressure-sensitive devices about? 

BS IEC 62047-34 is the thirty-fourth part of the Semiconductor devices and microelectromechanical devices that specifies the test methods and test procedures for MEMS piezoresistive pressure-sensitive devices on wafers.

By using BS IEC 62047-34 you can manufacture good quality microelectromechanical devices.  

BS IEC 62047-34 describes test conditions and test methods of electric character, static performances and thermal performances for MEMS pressure-sensitive devices. BS IEC 62047-34 applies to both open and closed loop piezoresistive MEMS pressure devices on the wafer.  

Who is BS IEC 62047-34- MEMS piezoresistive pressure-sensitive devices for? 

BS IEC 62047-34 Semiconductor devices are beneficial for: 

  • Semiconductor foundries 
  • Manufacturers of electronic devices 
  • Manufacturers of automobile 
  • Quality control executives  

Why should you use BS IEC 62047-34- MEMS piezoresistive pressure-sensitive devices? 

Micro-electromechanical systems (MEMS) are used to create tiny integrated devices or systems that combine mechanical and electrical components.  

BS IEC 6204734 specifies certain test methods and test procedures for MEMS piezoresistive pressure-sensitive devices on the wafer. The test methods help in measuring the resistance value, static performances and temperature influences on MEMS pressure-sensitive devices. Using BS IEC 62047-34 you can detect the signal by applying both open and closed-loop MEMS piezoresistive pressure-sensitive devices on the wafer. 

By applying BS IEC 62047-34 best practice guidelines, you can ensure sustainability and help in improving the quality of these MEMS piezoresistive pressure-sensitive devices on the wafer.