Semiconductor devices. Micro-electromechanical devices - Test method of bonding strength between PDMS and glass

Semiconductor devices. Micro-electromechanical devices - Test method of bonding strength between PDMS and glass

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What is BS EN 62047-15 - Bonding strength between PDMS and glass about?  

BS EN 62047-15 is the 15th part of a multi-series standard used for semiconductor devices.  

BS EN 62047-15 describes the test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for the building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high-pressure applications as in the case of certain peristaltic pump designs where an off-chip compressed air supply is used to drive the fluids in micro-channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also, in the case of systems having pneumatic microvalves, a relatively high level of bonding, particularly between two replica moulded layers of PDMS becomes quite necessary. Usually, there is a leakage and debonding phenomena between the interface of bonded areas, which causes instability and shortage of lifetime for MEMS devices.  BS EN 62047-15 specifies general procedures on bonding tests of PDMS and glass chip. 

Who is BS EN 62047-15 - Bonding strength between PDMS and glass for? 

BS EN 62047-15 on Semiconductor devices is useful for: 

  • Semiconductor foundries 
  • Manufacturer of electronic devices 
  • Manufacturer of automotive parts 
  • Electronic engineer 

Why should you use BS EN 62047-15 - Bonding strength between PDMS and glass 

A semiconductor device is an electronic component that contains the electronic properties of semiconductor material. 

BS EN 62047-15  can be your best guide in conducting the test method for bonding strength between PDMS and glass. The test methods are as follows: 

  • Visual test is a quantitative test method used for confirming the other bonding test is required for these devices  
  • The blister test is useful in measuring the bond strength between PDMS and glass 
  • Contract angle measurement is useful in measuring the hydrophilic characteristic of a surface for a polymer like PDMS 
  • Hermeticity test is useful in identifying the leakage between PDMS and PDMS chip or PDMS and glass chip 

By applying BS EN 62047-15, you can calculate the bond strength between PDMS and glass that results in manufacturing better quality semiconductor devices.