Semiconductor devices. Micro-electromechanical devices - Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

Semiconductor devices. Micro-electromechanical devices - Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

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What is BS EN 62047-11 - Linear thermal expansion of free-standing materials used in micro-electromechanical systems about?  

BS EN 62047-11 is the 11th part of an international standard used for Semiconductor devices.  

BS EN 62047-11 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) microelectromechanical system (MEMS) materials with the length between 0,1 mm and 1 mm and width between 10 μm and 1 mm and thickness between 0,1 μm and 1 mm, which are main structural materials used for MEMS, micromachines and others. This test method is applicable for the CLTE measurement in the temperature range from room temperature to 30 % of a material’s melting temperature. 

Who is BS EN 62047-11 - Linear thermal expansion of free-standing materials used in micro-electromechanical systems for? 

BS EN 62047-11 on Linear thermal expansion of free-standing materials used in micro-electromechanical systems is useful for: 

  • Manufacturers of semiconductor devices 
  • Manufacturers of electronic devices 
  • Manufacturers of automotive parts 
  • Electronic engineers 
  • Semiconductor foundries 
  • Quality control executives 

Why should you use BS EN 62047-11 - Linear thermal expansion of free-standing materials used in micro-electromechanical systems 

Micro-electromechanical systems (MEMS) are a process technology that is useful in creating tiny integrated devices or systems.  These devices are useful in combining mechanical and electrical components. 

BS EN 62047-11 specifies the test requirements, test methods, and test procedure for measuring the linear thermal expansion of free-standing materials used in micro-electromechanical systems. The test methods are as follows:  

  • Noncontact in-plane displacement measurement method is useful in measuring the thermal deformation (δT) as a function of temperature 
  • The entire profile of a specimen along the length direction is measured as a function of temperature by using the out-of-plane displacement measurement method 

By applying BS EN 62047-11 you can ensure the sustainability of these free-standing materials in different climatic conditions. This result in manufacturing good quality free-standing materials that are used in micro-electromechanical systems.