What is BS EN IEC 60749‑30 about?
BS EN IEC 60749‑30 is the 30th part of the multimerise Internation standard on semiconductor devices.
BS EN IEC 60749‑30 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
Note: Correlation of moisture-induced stress sensitivity conditions (or moisture sensitivity levels (MSL)) in accordance with IEC 60749-20 and this document and the actual reflow conditions used are dependent upon identical temperature measurement by both the semiconductor manufacturer and the board assembler. Therefore, the temperature at the top of the package on the hottest moisture sensitive SMD during assembly is monitored to ensure that it does not exceed the temperature at which the components are evaluated.
Note: For the purpose of this document, SMD is restricted to include only plastic encapsulated SMDs and other packages made with moisture-permeable materials.
Who is BS EN IEC 60749‑30 for?
BS EN IEC 60749‑30 on Semiconductor devices is useful for:
- Semiconductor foundries
- Manufacturer of electronic devices
- Manufacturer of automobile
Why should you use BS EN IEC 60749‑30?
Semiconductor devices are electronic components that rely on the electronic properties of semiconductor materials for their function.
BS EN IEC 60749‑30 helps to solve these problems by evaluating the heat resistance of surface mount devices (SMDs) after being soaked in an environment. BS EN IEC 60749‑30 helps to detect the devices which fail to meet room temperature datasheet specification.
BS EN IEC 60749‑30 helps in defining the preconditioning flow of non-hermetic solid state surface mount devices.
What’s changed since the last update?
BS EN IEC 60749‑30:2020 supersedes BS EN 60749‑30:2005+A1:2011. BS EN IEC 60749‑30:2020 includes some technical changes with respect to BS EN 60749‑30:2005+A1:2011. These include:
- Inclusion of new Clause 3
- Expansion of 6.7 on solder reflow
- Inclusion of explanatory notes and clarifications