Semiconductor devices. Mechanical and climatic test methods - Particle impact noise detection (PIND)

Semiconductor devices. Mechanical and climatic test methods - Particle impact noise detection (PIND)

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What is BS EN 60749-16 Particle impact noise detection about?  

BS EN 60749-16 is an international standard that focuses on the quality and performance of semiconductor devices and particle impact noise detection.  

BS EN 60749-16 serves the purpose to detect the presence of loose particles inside a cavity device such as chips of ceramic, pieces of bonding wire, or solder balls (prills). 

BS EN 60749-16 stipulates the technicalities such as related terms and definitions, test apparatus, test sample, test procedures, evaluation, etc., for the mechanical and climatic test methods for semiconductor devices with memory. 

Who is BS EN 60749-16 Particle impact noise detection for? 

BS EN 60749-16 on particle impact noise detection is useful for: 

  • Semiconductor device manufacturers 
  • Suppliers and exporters of semiconductor devices 
  • Test authorities for semiconductor devices 
  • Regulatory authorities 
  • Quality control personnel  

Why should you use BS EN 60749-16 Particle impact noise detection 

Semiconductor devices are electronic components that rely on the electronic properties of semiconductor materials for their function. Particle Impact Noise Detection (PIND or PIN-D) is designed to identify the presence of loose particles inside a device cavity that can impact the functionality, reliability, or even personal safety. 

BS EN 60749-16 provides you with the test method to detect particle contamination within the internal cavity of a device, especially in cases where X-Ray inspection is limited or not possible. It includes the devices such as rad-hardened devices, which helps you to avoid any mechanical damage such as cracking, chipping, or breaking that leads to overall product/application failure. 

BS EN 60749-16 gives you detailed information about the apparatus needed to perform the test, explains the principle of the test, helps the users with the evaluations as well as concludes the final test summary. It also helps you identify the failures if the parametric limits are exceeded or if functionality cannot be demonstrated under nominal and worst-case conditions. 

Overall, BS EN 60749-16 proves very helpful to the users to evaluate the efficiency and the reliability of the semiconductor devices with memory.