Semiconductor devices. Mechanical and climatic test methods - Latch-up test

Semiconductor devices. Mechanical and climatic test methods - Latch-up test

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1   Scope and object

This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated circuits.
This test is classified as destructive.
The purpose of this test is to establish a method for determining integrated circuit (IC) latch-up characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing "no trouble found" (NTF) and "electrical overstress" (EOS) failures due to latch-up.
This test method is primarily applicable to CMOS devices. Applicability to other technologies must be established.
The classification of latch-up as a function of temperature is defined in 3.1 and the failure level criteria are defined in 3.2