What is BS EN 60749-20-1 – Handling, packaging, labelling procedures for semiconductors about?
BS EN 60749-20-1 is an international standard that focuses on mechanical and climatic tests with handling, packaging, labelling and shipping of semiconductor devices.
BS EN 60749-20-1 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air.
BS EN 60749-20-1 specifies the handling conditions for SMDs subjected to the above test conditions. Two test conditions, method A and method B are specified in the soldering heat test of IEC 60749-20.
For method A, moisture soak conditions are specified on the assumption that moisture content inside the moisture barrier bag is less than 30 % RH.
For method B, moisture soaking conditions are specified on the assumption that the manufacturer’s exposure time (MET) does not exceed 24 h and the moisture content inside the moisture barrier bag is less than 10 % RH.
Note: Hermetic SMD packages are not moisture sensitive and do not require moisture precautionary handling.
Who is BS EN 60749-20-1 - Handling, packaging, labelling procedures for semiconductors for?
BS EN 60749-20-1 on Handling, packaging, labelling procedures for semiconductors is useful for:
- Packaging unit of semiconductor devices
- Manufacturers and suppliers of semiconductor devices
- Dealers and distributors of semiconductor devices
- Quality assurance professionals
- Regulatory authorities
Why should you use BS EN 60749-20-1 - Handling, packaging, labelling procedures for semiconductors?
Moisture from atmospheric humidity enters permeable packaging materials by diffusion. Assembly processes used to solder SMDs to printed circuit boards (PCBs) expose the entire package body to temperatures higher than 200 °C. During solder reflow, the combination of rapid moisture expansion, materials mismatch, and material interface degradation can result in package cracking and/or delamination of critical interfaces within the package.
The advent of surface-mount devices (SMDs) introduced a new class of quality and reliability concerns regarding package damage ‘‘cracks and delamination’’ from the solder reflow process.
BS EN 60749-20-1 is an informative specification that discusses the standardized levels of floor life exposure for moisture/reflow-sensitive SMDs along with the handling, packing and shipping requirements necessary to avoid moisture/reflow-related failures.
BS EN 60749-20-1 provides the SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs which have been classified to the levels defined. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation.
By using the procedures given in BS EN 60749-20-1, a safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry bags from the seal date.