Semiconductor devices - Mechanical and climatic test methods - Guidelines for IC reliability qualification plans

Semiconductor devices - Mechanical and climatic test methods - Guidelines for IC reliability qualification plans

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1   Scope

This part of IEC 60749 gives guidelines for reliability qualification plans of semiconductor integrated circuit products (ICs). This document is not intended for military- and space-related applications.

NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this guideline adaptation based on EDR‑4708, AEC Q100, JESD47 or other relevant document can also be applicable if it is specified.

NOTE 2 The Weibull distribution method used in this document is one of several methods to calculate the appropriate sample size and test conditions of a given reliability project.