What is BS EN IEC 60749-3 - External visual examination of semiconductor devices about?
BS EN IEC 60749 is an international standard covering external visual examination of semiconductor devices that facilitates testing, classification and applicability of semiconductor devices.
The purpose of BS EN IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.
In BS EN IEC 60749, is an external visual inspection is a non-destructive test and is applicable for all package types. The test is useful for qualification, process monitoring, or lot acceptance.
Who is BS EN 60749-3 - External visual examination of semiconductor devices for?
BS EN 60749-3 on external visual examination is relevant to:
- Semiconductor device manufacturers
- Dealers and importers of semiconductor devices
- Manufacturer of electronic devices
- Product design engineers
- Automobile industry
- Electrical engineers
Why should you use BS EN 60749-3 - External visual examination of semiconductor devices?
Semiconductor devices are electronic components that rely on the electronic properties of semiconductor materials for their function. They are usually made of semiconductor materials such as silicon, germanium, and gallium arsenide for their function.
The test methods provided under BS EN 60749-3 helps you to avoid any mechanical damage such as cracking, chipping, or breaking that leads to overall product/application failure.
Failure criteria defined in BS EN 60749-3 assist you in identifying visual signs of corrosion, contamination, defects, or damage resulting from manufacturing, handling, testing, evidence of damage, corrosion, or contamination that will interfere with the device's normal operation.
Overall, BS EN 60749-3 can help identify and mitigate reports and classify the results of external visual inspection, minimize fatigue, and maintain operational efficiency and the service life of the end application.
What’s changed since the last update?
BS EN 60749-3:2017 supersedes BS EN 60749‑3:2002, which is withdrawn. BS EN 60749-3:2017 includes some technical changes with respect to BS EN 60749‑3:2002. This includes:
- Reference to the need for ESD protection
- Inclusion of information on the phenomenon of tin whiskers
- Inclusion of an optional report form/checklist