What is BS EN 60749-35 – Plastic encapsulated components testing about?
BS EN 60749-35 is an international standard that focuses on mechanical and climatic test methods for semiconductor devices with acoustic microscopy for plastic encapsulated electronic components.
BS EN 60749-35 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components.
BS EN 60749-35 provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
Who is BS EN 60749-35 – Plastic encapsulated components testing for?
BS EN 60749-35 on plastic encapsulated components testing is useful for:
- Manufacturers of plastic encapsulated components
- Manufacturer of electronic devices
- Manufacturers and suppliers of semiconductor devices
- Product design engineers
- Quality assurance authority
Why should you use BS EN 60749-35 - Acoustic microscopy methods for plastic encapsulated electronic components?
Semiconductor devices are electronic components that rely on the electronic properties of semiconductor materials for their function. BS EN 60749-35 informs about generic procedures of acoustic microscopy techniques which helps users to test the electronic components used in semiconductor devices.
BS EN 60749-35 acts as a manual for operational details related to acoustic microscopy methodology, that applies to plastic encapsulated electronic components. It lays down the stipulations for performing mechanical and climatic tests on the electronic components.
BS EN 60749-35 gives you detailed information about the apparatus needed to perform the test, explains the principle of the test, helps the users with the evaluations as well as concludes the final test summary. It also helps you identify the failures if the parametric limits are exceeded or if functionality cannot be demonstrated under nominal and worst-case conditions.
Overall, BS EN 60749-35 proves very helpful to the users to evaluate the efficiency and reliability of the plastic encapsulated electronic components, with the help of acoustic microscopy methods.