Semiconductor devices. Flexible and stretchable semiconductor devices - Bending test method for conductive thin films on flexible substrates

Semiconductor devices. Flexible and stretchable semiconductor devices - Bending test method for conductive thin films on flexible substrates

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What is BS IEC 629511 - Flexible and stretchable semiconductor devices about?  

BS IEC 62951-1 is an international standard that discusses semiconductor devices for flexible and stretchable semiconductor devices. 

BS IEC 629511 is the first part of the multi-series that specifies a bending test method to measure the electromechanical properties or flexibility of conductive thin films deposited or bonded on flexible non-conductive substrates. 

Who is BS IEC 629511 - Flexible and stretchable semiconductor devices for? 

BS IEC 629511 on flexible and stretchable semiconductor devices is useful for: 

  • Semiconductor foundries  
  • Manufacturers of electronic devices  
  • Automotive industry 
  • Quality testing and control agencies 

Why should you use BS IEC 629511 - Flexible and stretchable semiconductor devices?  

A thin film is a tiny coating of material that can be fractions of a nanometer thick to several micrometres thick. Flexible electronics are devices made from stretchy or conformable substrates, such as plastic, metal foil, paper, or flexible glass. 

The object of BS IEC 629511 is to establish simple and repeatable test methods for evaluating the electromechanical properties or flexibility of conductive thin films on a flexible substrate. 

BS IEC 629511 helps avoid the formation of cracks or flaws and delamination from the substrate. By using BS IEC 62951‑1 you can conduct the testing method to measure the electromechanical property of conductive thin films. 

BS IEC 629511 can be your guide in conducting the test and helps to determine the mechanical and electrical properties of test materials for flexible and stretchable semiconductors. This test method aids in the development of higher-quality semiconductor devices as well as the evaluation of a material's ductility and soundness.