What is BS EN 61193-1 - Defects on printed board assemblies about?
BS EN 61193-1 is the first part of a multi-series standard used for quality assessment systems.
BS EN 61193-1 defines methods of registration and analysis of defects on soldered
printed board assemblies. Methods are described to allow effective comparison of performance between products, processes, and production locations and can serve as a basis for general quality improvement.
BS EN 61193-1 specifies defect data collection in two categories:
- Category 1 ppm data: this category provides data for registration purposes intended to enable overall performance comparison of assembly operations.
- Category 2 ppm data: this category provides data intended for individual subprocess assessment, analysis, and control purposes.
Who is BS EN 61193-1 - Defects on printed board assemblies for?
BS EN 61193-1 on Quality assessment systems is useful for:
- Manufacturer of printed circuit boards
- Manufacturers of electronic devices
- Manufacturers of automotive parts
- Electronic engineers
Why should you use BS EN 61193-1 - Defects on printed board assemblies?
Printed boards mechanically support electronic components using conductive pads in the shape designed to accept the component's terminals. This helps in connecting these PCBs electrically by using traces, and planes.
BS EN 61193-1 is useful in counting the defect on the products. These defects are counted at the level of solder joints. The defects are identified by using the post soldering inspection method. Register data is subdivided into defects per process type and defects per component type. This helps in characterizing the defects according to the post soldering defects and the entire body of data relating to the whole process sequence. With the help of these data, you can determine the parts per million (ppm) level of the inspected production unit.
By applying BS EN 61193-1, you can analyze the defects that result in standardizing the quality of these printed board assemblies.