Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Mitigation of deleterious effects of tin

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Mitigation of deleterious effects of tin

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1   Scope

This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems.
This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes.
This document may be used by other high-performance and high-reliability industries, at their discretion.