What is BS IEC 62899‑202‑7 on printed electronics (printed film circuit boards) about?
BS IEC 62899‑202‑7 is a part of a multi-series on printed electronics. BS IEC 62899‑202‑7 is about printed film that works as a circuit board. BS IEC 62899‑202‑7 proposes a new standard test method to measure the peel strength of a printed layer on a flexible substrate.
This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in BS IEC 62899‑202‑7 can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.
Who is BS IEC 62899‑202‑7 on printed electronics (printed film circuit boards) for?
BS IEC 62899‑202‑7 on printed electronics (printed film circuit boards) is useful for:
- Circuit board manufacturers
- Manufacturers of electronic components like computer chips
- Quality control personnel
Why should you use BS IEC 62899‑202‑7 on printed electronics (printed film circuit boards)?
As technology has advanced, devices have become more compact. Circuit boards have also evolved. A printed layer on a flexible substrate is widely employed as an electrode or interconnection for flexible devices. Printed film circuit boards are now used on compact devices. A conductive ink prints on the film to make a conductive circuit board. A simple tape test method has been widely used for qualitative adhesion measurement, but it cannot be used to measure the strength of adhesion between the printed layer and the flexible substrate.
The test method in BS IEC 62899‑202‑7 calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. BS IEC 62899‑202‑7 will help you to monitor and compare the thickness dependence of the peel strength of a printed layer on the same flexible substrate.