What is BS IEC 62899-202-5 - conductive ink mechanical bending test about?
Printing technologies are widely used for the development of flexible and stretchable electronics as they offer a cost-effective fabrication alternative to traditional approaches. A printed conductive layer on an insulating substrate can be employed as an electrode or as an interconnect for flexible devices.
BS IEC 62899-202-5 guidelines enable you to determine the bending capacity of printed conductive layers. BS IEC 62899-202-5 specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation. This sliding plate test method can be availed for practical application in the industry by enabling the long-term reliability testing of printed film.
Who is BS IEC 62899-202-5 - conductive ink mechanical bending test for?
BS IEC 62899-202-5 on conductive ink mechanical bending test is useful for:
- Manufacturers of electronic circuits
- Manufacturers of PCB boards
- Product development / innovation / research teams
- Quality control teams
- Manufacturers of:
- Wearable medical devices (pacemakers, hearing aids, etc.)
- LEDs (Light and motion systems, colour-changing lights, etc.)
- Consumer electronics (laptops, cameras, calculators, etc.)
- Industrial equipment (robotic arms, HMI equipment, etc.)
- Automotive components (GPS systems, antilock brakes, etc.)
Why should you use BS IEC 62899-202-5 - conductive ink mechanical bending test?
The printing process is a highly promising technology for the fabrication of flexible circuit boards. As LCD matrix arrays get larger and more complex, the requirement to obtain low resistance address lines becomes progressively more important. A method of producing a conductive layer on an insulating substrate is required. BS IEC 62899-202-5 considers the unique characteristics of the printed films that are fabricated on a polymer substrate, which is weak under high temperatures.
These films are operated under severe mechanical deformations, unlike the conventional Si or glass-based conductive films. BS IEC 62899-202-5 discusses various test methods to determine the mechanical bending test of a printed conductive layer on an insulating substrate so that you can decide on the uses of the material accordingly. The stress state in bending deformation and damage area and electrical resistance change after sliding have been discussed thoroughly in BS IEC 62899-202-5. Using BS IEC 62899-202-5 guidelines, you would be able to determine the bending capacity of printed conductive layers, and innovate products; bringing revolutionized technology to end-users.