Printed board assemblies - Sectional specification. Requirements for surface mount soldered assemblies

Printed board assemblies - Sectional specification. Requirements for surface mount soldered assemblies

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1   Scope

This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through - hole, chip mounting, terminal mounting, etc.).