This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.

This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

A Commented Version (CMV) of this standard is available here. Please note, the CMV of the standard is not adopted, and therefore doesn’t contain an additional national foreword, or national annex that might be contained in the BS adoption of the standard. However the IEC text that forms the content of the standard is identical to the BS adoption of the standard.

Commented Versions (CMVs) are specialized publications featuring detailed commentary from technical experts on the major changes between the new edition of a standard and the previous one. Comments may include an explanation for the changes as well as information on the impact of these changes on the application and usability of the standard.