Methods for the sampling and analysis of tin and tin alloys - Method for the determination of copper in ingot tin and tin-lead solders (photometric method)

Methods for the sampling and analysis of tin and tin alloys - Method for the determination of copper in ingot tin and tin-lead solders (photometric method)

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What is BS 3338-4 – Tin and tin alloys about?

BS 3338-4 standard is the part of the BS 3338 series that discusses the determination of copper in ingot tin and tin-lead solders using the photometric method for the sampling and analysis of tin and tin alloys. Tin and tin alloys are the properties of tin making it ideal for use as a coating. Owing to the low melting point of tin, and because it readily alloys with most other metals, tin coatings can easily be produced by immersing a suitably prepared metal object in a bath of molten tin.

Who is BS 3338-4 – Tin and tin alloys for?

BS 3338-4 on the determination of copper that applies to:

  • Manufacturer of tin alloys
  • Quality testing personnel
  • Designing engineer

Why should you use BS 3338-4 – Tin and tin alloys?

Tin is alloyed with lead to produce solders with melting points lower than those of either tin or lead. Small amounts of various metals, notably antimony and silver, are added to tin-lead solders to increase their strength. Photometric measurement, or photometry, is a technique that can be used to measure the concentration of organic and inorganic compounds in solution by determining the absorbance of specific wavelengths of light.

BS 3338-4 provides you with the principle in which the copper is determined photometrically with a hydrobromic acid/phosphoric acid mixture. It also provides a range from 0.01 to 0.4 per cent copper. This helps you in the sampling and analysis of tin and tin alloys.

BS 3338-4 exemplifies the copper in ingot tin and tin-lead solders using the photometric method for the analysis of tin and tin alloys.