What is BS 5909 – Oxygen-free copper about?
BS 5909 is a British standard on the method for scale adhesion test for oxygen-free copper. These characteristics are high ductility, high electrical and thermal conductivity, high impact strength, good creep resistance, ease of welding, and low relative volatility under high vacuum.
BS 5909 specifies a procedure for the scale adhesion testing of oxygen-free high-conductivity copper.
Who is BS 5909 – Oxygen-free copper for?
BS 5909 on oxygen free copper applies to:
- Manufacturer of oxygen free copper
- Design engineers
Why should you use BS 5909 – Oxygen-free copper?
The basic goal of adhesion testing is to produce a coating failure. The coating under test may experience an interface failure between the substrate and coating or between the individual coating layers in a multi-layer application. Oxygen free copper is a high ductility, high electrical and thermal conductivity, high impact strength, good creep resistance, ease of welding, and low relative volatility under high vacuum.
BS 5909 provides you with the principle in which the Preparation and heating are done in air of a test piece, followed by rapid cooling in water. Visual examination of the cooled test piece for loss of the oxide film or blistering. BS 5909 also provides the procedures in which the heat of the test piece, prepared in accordance with clause 4, in air at 850 to 875 °C for 30 min and immerse immediately in cold water.
Overall, BS 5909 provides you with comprehensive guidance useful throughout the process of adhesion test for oxygen-free copper.