What is BS EN 60191-6-19 - Measurement methods of the package warpage used in semiconductor devices about?
BS EN 60191-6-19 is the sixth part of a multi-series standard used for the Mechanical standardization of semiconductor devices.
BS EN 60191-6-19 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array (BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).
Who is BS EN 60191-6-19 - Measurement methods of the package warpage used in semiconductor devices for?
BS EN 60191-6-19 on Mechanical standardization of semiconductor devices is useful for:
- Manufacturers of semiconductor devices
- Manufacturers of electronic devices
- Manufacturers of automotive parts
- Electronic engineers
- Semiconductor foundries
Why should you use BS EN 60191-6-19 - Measurement methods of the package warpage used in semiconductor devices?
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material.
BS EN 60191-6-19 specifies the measuring methods and procedures for mechanical standardization of semiconductor devices. The measuring method is as follows:
- Shadow moiré measuring method is useful in observing the stripe pattern through the grating results in the moiré fringe pattern. This also helps in measuring the area and the warpage at elevated temperatures including the peak temperature.
- Laser reflection method is useful in measuring the displacement by using a laser displacement sensor.
BS EN 60191-6-19 provides the datasheet which helps in conducting these tests according to this sheet. This is useful in ensuring the sustainability of these semiconductor devices in different climatic conditions. By applying BS EN 60191-6-19, you can manufacture good quality semiconductor devices.