Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

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1   Scope

This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191‑4.