Mechanical standardization of semiconductor devices - Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Mechanical standardization of semiconductor devices - Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

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What is BS EN 60191-6-13 - Mechanical standardization of semiconductor devices about?  

BS EN 60191-6-13 is a European Standard that discusses the mechanical standardization of semiconductor devices. 

BS EN 60191-6-13 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. 

Who is BS EN 60191-6-13 - Mechanical standardization of semiconductor devices for? 

BS EN 60191-6-13 on open-top-type sockets for FBGA and FLGA is relevant to:  

  • Manufacturers of semiconductor devices  
  • Product designer engineers  
  • Technical consultants  
  • Mechanical engineers  

Why should you use BS EN 60191-6-13- Mechanical standardization of semiconductor devices?  

Semiconductors are a vital component of electronic equipment, allowing for advancements in communications, computers, healthcare, military systems, transportation, clean energy, and a variety of other fields.  

BS EN 60191-6-13 aims to standardize the outer dimensions of the sockets for FBGA and FLGA, where leading-edge developments are aggressively innovated, to establish their compatibility with the needs of the surface-mount industry that is globally expanding due to enhanced functions and performances of electrical devices. 

For defining each dimension, the target was to indicate BS EN 60191-6-13 design value which has the concept of the design centre as much as possible, aiming to enhance the function as a standardization index. 

What’s changed since the last update?  

BS EN 60191-6-13:2016 supersedes BS EN 60191-6-13:2007, which is withdrawn. BS EN 60191-6-13:2016 includes some technical changes with respect to BS EN 60191-6-13:2007. These include:  

  • BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2, and 3, and twenty-two socket sizes have been added to socket group number 4.