Mechanical standardization of semiconductor devices - Coding system and classification into forms of package outlines for semiconductor device packages

Mechanical standardization of semiconductor devices - Coding system and classification into forms of package outlines for semiconductor device packages

£272.00
£272.00
£136.00
Sold out

1   Scope

This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.
The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability.