Integrated optics. Vocabulary - Terms used in classification

Integrated optics. Vocabulary - Terms used in classification

Regular price
£166.00
Sale price
£166.00
Regular price
£83.00
Sold out
Unit price
per 

What is ISO 118072 - Integrated optics about?  

ISO 118072 is the second part of the multi-series International standard that defines terms used in the classification of integrated optical elements, integrated optical components, and integrated optical devices, which find applications, for example, in the fields of optical communications and sensors. 

Who is ISO 118072 - Integrated optics for? 

ISO 118072 on integrated optics is useful for: 

  • Manufacturers of integrated optical devices 
  • Manufacturers of electronic devices 

Why should you use ISO 118072 - Integrated optics 

Integrated optics is a technology that deals with the construction of photonic integrated circuits, containing several optical components. These several optical components are combined to fulfill some or less complex functions.   

These Integrated optics are classified in three major fields based on user-oriented criteria. The first criteria are to classify the devices in single mode or in multiple modes. The second criteria are helpful in classifying the complexity of elements, components and devices. The third criteria help in classifying the functions of the integrated devices or components.  

ISO 118072 will help you in classifying optical elements and also helps in the optical assembling of integrated optic devices. ISO 118072 helps in delivering the electrical signal through an additional port in these devices. Basically, ISO 118072 helps you in converting electrical signals into optical signals and vice versa.  

What’s changed since the last update?  

BS EN ISO 118072:2021 supersedes BS EN ISO 118072:2005 

BS EN ISO 118072:2021 includes some technical changes with respect to BS EN ISO 118072:2005. These include: 

  • Terminologies that have not been frequently used over the last 5 to 10 years are revised to those matching current trends 
  • In particular, in 3.1 types of component configuration, the configuration is revised by adding a new configuration, component, while “chip” is replaced for “component” and” module” 
  • In 3.2 “controllable” is replaced by “dynamic,” which is placed between passive and active 
  • In the revision process, terminologies and definitions are compared to similar terminology definitions in IEC and harmonized