What is BS IEC 63011-1about?
BS IEC 63011-1 is the first part of the BS IEC 63011 series of standards that provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided. BS IEC 63011-1 provides terminology that will help in performing their work which will prevent them from any work hazards.
Who is BS IEC 63011-1 for?
BS IEC 63011-1 on integrated circuits is useful for:
- Integrated circuits manufacturers
- Electronic appliance manufacturers
Why should you use BS IEC 63011-1?
High-performance electrical system requires a massive data exchange between processing integrated circuit (IC) and storage IC. Stacked multiple ICs with a large number of vertical interconnects among dies are an innovative way of providing higher data transfer rate among dies. In addition to bumps, metal pillars, or metal pads which are traditional ways of interconnection between dies, through-silicon vias enable to configure the integration of three or more dies. The integration environment of multichip IC is significantly different from that of the integration on a printed circuit board. BS IEC 63011-1 describes definitions pertaining to the multichip ICs, will help you to understand your work and provide safety while working.