What is ISO/IEC TS 23167 about?
The use of cloud computing has grown, a set of commonly used technologies has grown to support, simplify and extend the use of cloud computing alongside sets of commonly used techniques which enable the effective exploitation of the capabilities of cloud services.
ISO/IEC TS 23167 provides a description of a set of common technologies and techniques used in conjunction with cloud computing. These include:
- Virtual machines (VMs) and hypervisors
- Containers and container management systems (CMSs)
- Serverless computing
- Microservices architecture
- Automation
- Platform as a service systems and architecture
- Storage services
- Security, scalability and networking as applied to the above cloud computing technologies
Who is ISO/IEC TS 23167 for?
ISO/IEC TS 23167 on common technologies and techniques used in cloud computing is useful for:
- Cloud service providers
- IT professionals
- Cloud engineers and developers
- Software developers
- Organizations involved in designing cloud solutions
Why should you use ISO/IEC TS 23167?
ISO/IEC TS 23167 describes the common technologies and techniques which relate to cloud computing, to describe how they relate to each other and to describe how they are used by some of the roles associated with cloud computing. These common technologies and techniques are aimed at developers and operations staff, increasingly linked together in a unified approach called DevOps which helps you to speed and simplify the creation and operation of solutions based on the use of cloud services.
ISO/IEC TS 23167 gives guidance on serverless computing, which is a cloud service category in which the cloud service customers can use different cloud capabilities types without the cloud service customer (CSC) having to provision, deploy and manage either hardware or software resources, other than providing CSC application code or providing CSC data. The benefits of serverless computing to the CSC can include reduced operational costs associated with scaling to meet varying workload, lower packaging and deployment complexity.