What is BS EN IEC 62148‑21 - Fibre optic active components and devices about?
BS EN IEC 62148 is a series on Fibre optic active components and devices. Fibre optic active components and devices are electronic components made up of semiconductor materials that actively manipulate electrons to perform the intended function. BS EN IEC 62148‑21 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In BS EN IEC 62148‑21 electrical interface for the S-FBGA package is informative.
The purpose of BS EN IEC 62148‑21 is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
Who is BS EN IEC 62148‑21 - Fibre optic active components and devices for?
BS EN IEC 62148‑21 on Fibre optic active components and devices are applicable to:
- Telecommunication component manufacturers
- Telecommunication equipment manufacturers
- Design engineers
- Quality control personnel
Why should you use BS EN IEC 62148‑21 - Fibre optic active components and devices?
Fibre optic active components and devices require a source of energy to operate and have an output that is a function of present and past input signals. Types of active devices include controlled power supplies, transistors, light sources, amplifiers, and transmitters. Implementing BS EN IEC 62148‑21 gives some extra benefits of immunity to the electromagnetic field, long lifetime, low manufacturing costs, high sensitivity, and durability.
Freedom from electrical short circuits or ground loops, safety in the combusting environment, security from monitoring, large bandwidth etc. such benefits can be obtained by the implementation of BS EN IEC 62148‑21 to have a transmission with the least attenuation and for a longer distance. Using BS EN IEC 62148‑21 you can understand the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA).