1 Scope
This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations
and is also applicable to surface mount devices (SMDs).
The recommended test methods suitable for specific terminations/lead of devices are
shown in Table 1.
Table 1
—
Selection of test methods suitable for specific terminations/leads
|
Test method
|
Component
|
Mounted/not mounted
|
See Clause
|
|
|---|---|---|---|---|
|
Test
|
Type
|
|||
| Ua1 | Tensile | Leaded devices | Not mounted | Clause 4 |
| Ua2 | Thrust | Leaded devices | Not mounted | Clause 4 |
| Ub | Bending | Leaded devices | Not mounted | Clause 5 |
| Uc | Torsion | Leaded devices | Not mounted | Clause 6 |
| Ud | Torque | Threaded stud, screw or other terminations | Not mounted | Clause 7 |
| Ue1 | Substrate bending | Surface mount devices | Mounted | Clause 8 |
| Ue2 | Pull/push | Surface mount devices | Mounted | Clause 8 |
| Ue3 | Shear | Surface mount devices | Mounted | Clause 8 |
| Uf1 | Body strength | Surface mount devices | Not mounted | Clause 9 |
| Uf2 | Impact shock | Surface mount devices | Not mounted | Clause 9 |