This part of IEC 60068 , which is a Technical Report, describes the creation of temperature-time profiles (in specific envelope profiles) for reflow soldering of electronic assemblies, considering tolerances resulting from the accuracy of the measuring equipment, preparation method and specifications of the manufacturers of components, circuit boards, solder paste, etc.).

The envelope profile given in this document does not represent a temperature-time profile for qualification but defines the reflow process window for the soldering of electronic assemblies. Qualification profiles can be found, for example, in IEC 60068‑2‑58 for resistance to soldering heat, or in IEC 60749‑20, IEC 61760‑4 and IPC/JEDEC J-STD-020E for moisture sensitivity classification of components.