What is PD IEC/TR 60068-3-12 - Lead-free solder reflow temperature profile about?
PD IEC/TR 60068-3-12 is a standard that covers lead-free solder reflow temperature profile, enabling the selection and application of reflow temperature profiles for improved soldering strength and performance in electronic components.
PD IEC/TR 60068-3-12 is a technical report, that presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste.
PD IEC/TR 60068-3-12 process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components).
In PD IEC/TR 60068-3-12, study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances.
In PD IEC/TR 60068-3-12, study B represents consumer electronics products and includes reflow oven capability, board design and package sizes.
Who is PD IEC/TR 60068-3-12 - Lead-free solder reflow temperature profile for?
PD IEC/TR 60068-3-12 on lead-free solder reflow temperature profile applies to:
- Manufacturers of PCB
- Dealers and importers of PCB
- Testing houses and labs for PCB
- Soldering technicians
- PCB and electronic component manufacturers
Why should you use PD IEC/TR 60068-3-12 - Lead-free solder reflow temperature profile?
The process of modifying reflow oven temperatures to melt and cure lead-free solder paste on PCB pads is known as lead-free reflow soldering. The SMD components are soldered on the PCB pads once the PCBAs have cooled.
PD IEC/TR 60068-3-12 provides users guidance on boards under investigation, temperature tolerances, peak form and width, classification, consideration for a lead-free reflow temperature profile, ensuring stronger soldering strength electronic components and products.
With obedience and compliance to PD IEC/TR 60068-3-12, users can design and develop PCB’s and electronic products using suitable lead-free solder reflow temperature profile, ensuring improved resistance to fatigue from thermal cycles, reliable joints, and operational efficiency at higher temperatures.
What’s changed since the last update?
PD IEC/TR 60068-3-12:2014 supersedes PD IEC/TR 60068-3-12:2007, which is now withdrawn.