What is EN 62137-3 - Selecting the test methods for solder joints used in electronic components about?
BS EN 62137-3 is the third part of multi-series standard used for Electronics assembly technology that specifies the test methods and test procedure for solder joints. BS EN 62137-3 can be your best guide in selecting the test method for solder joints used in electronic devices.
BS EN 62137-3 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys.
Who is EN 62137-3 - Selecting the test methods for solder joints used in electronic components for?
BS EN 62137-3 on Selecting the test methods for solder joints used in electronic components is useful for:
- Manufacturer of electronic components
- Manufacturer of automotive parts
- Electronic engineer
Why should you use BS EN 62137-3 - Selecting the test methods for solder joints used in electronic components?
Solder joints are useful in the electronic industry as it helps in connecting the electrical components or circuits.
BS EN 62137-3 can be your best guide in selecting the test method for solder joints used in electronic components. The test methods are as follows:
- Solder joint strength test of SMD is useful in evaluating the degree of degradation of solder joint strength and other characteristics of a solder joint
- Cyclic bending strength test helps in determining the bending capacity of these joints
- Mechanical shear fatigue test is useful in determining the values and helps in detecting the solder joint breaks
- Cyclic drop test and cyclic steel ball drop strength test is useful in detecting solder joint break by using electrical discontinuity of a circuit
By applying BS EN 62137-3, you can manufacture good quality electronic devices by using these solder joints.