1 Scope and object
This part of IEC 60512, when required by the detail specification, is used for testing connectors within
the scope of IEC technical committee 48. It may also be used for similar devices when
specified in a detail specification.
The object of this standard is to define a standard test method to assess the possibility
of whisker growth by external mechanical stress on the tin and tin-alloy plated parts of a connector
in its application (after wire termination, after soldering, after mounting, mated
with counterpart).
This standard does not cover internal stress type whisker.
NOTE 1 The test method dealing with internal stress type whisker, which is caused by the formation of intermetallic compound by diffusion, or by the
formation of oxide film of the plating surface, or by the difference between coefficients
of thermal expansion, is specified in IEC 60068‑2‑82.
While for internal stress type whisker, it is possible to apply accelerated test conditions, e.g.: by damp heat or temperature
cycling, for the external mechanical stress type whisker covered by this standard, due to the different whisker generation mechanism, there are no accelerated conditions. The test detailed in this
standard shall then be conducted under normal ambient conditions.
NOTE 2 Physical changes during the application process may cause changes of the material
qualities, so that this test cannot be used as a qualification test of a connector
in ‘as produced’ condition.
NOTE 3 The conditions specified in this test may accelerate the growth of tin whiskers in a test specimen, but no correlation has been demonstrated between the extent of
whisker growth, which may occur in this test, and the extent of whisker growth which may be expected in actual use. Whisker growth in actual use may therefore be less than or greater than the extent of whisker growth found when using this test.
