Circuit boards and circuit board assemblies. Design and use - Land pattern design. Generic requirements for land pattern on circuit boards

Circuit boards and circuit board assemblies. Design and use - Land pattern design. Generic requirements for land pattern on circuit boards

Regular price
£272.00
Sale price
£272.00
Regular price
£136.00
Sold out
Unit price
per 

What is BS EN IEC 6118861 - Circuit boards about?  

BS EN IEC 6118861 is the sixth part of the European standard on circuit boards and circuit board assemblies in multi-series.   

BS EN IEC 6118861 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land patterns for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3, and IEC 61191-4. 

Who is BS EN IEC 6118861 - Circuit boards for? 

BS EN IEC 6118861 on circuit boards and circuit board assemblies is useful for: 

  • Manufacturer of circuit boards and circuit board assemblies 
  • Manufacturers of electronic equipment 
  • Electrician 

Why should you use BS EN IEC 6118861 - Circuit boards? 

The circuit board is the building block of most modern electronic devices. The land pattern is the arrangement of pads in surface mount technology used to physically attach and electrically connect a component to a printed circuit.  

BS EN IEC 6118861 will help you in selecting the electronic components that fulfill the electrical requirement of the end product. BS EN IEC 6118861 helps to process characteristics of both soldering techniques, different land dimensions are required to form reliable solder joints and accurate placement of components after soldering. BS EN IEC 6118861 helps to avoid the solder bridges on the circuit board. As the terminals are in different sizes and shapes BS EN IEC 6118861 helps to design land patterns according to the size and shape of terminals.  

BS EN IEC 6118861 will help you in designing the land pattern of circuit boards as it ensures the reliability of solder joints.      

What’s changed since the last update?  

BS EN IEC 6118861:2021 supersedes BS EN 6118851:2002 

BS EN IEC 6118861:2021 includes some technical changes with respect to BS EN 6118851:2002. These include: 

  • The content is completely updated to reflect current industry requirements