Circuit boards and circuit board assemblies. Design and use - Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

Circuit boards and circuit board assemblies. Design and use - Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

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What is BS EN IEC 6118862 about?  

BS EN IEC 6118862 describes the requirements of design and use for soldering surfaces of land patterns on circuit boards. This document includes a land pattern for surface-mounted components. 

Who is BS EN IEC 6118862 for? 

BS EN IEC 6118862 on circuit boards and circuit board assemblies are useful for: 

  • Circuit board manufacturers 
  • PCB manufacturers 
  • Circuit board designers and technicians 

Why should you use BS EN IEC 6118862?  

The calculated land pattern geometry for an electronic component can be different depending upon the type of soldering process to be used. Wherever possible, land patterns should be defined in such a manner that is transparent to the attachment process being used. 

BS EN IEC 6118862 provides guidance on soldering methods for surface mounted components and requirements for soldering the components. BS EN IEC 6118862 helps you designate circuit board components on the land pattern based on their terminal dimensions and the soldering method that would be suitable for them. 

This enables the users of BS EN IEC 6118862 to appropriately install the components on land pattern circuit boards.